METAL FINISHING

RSI has been active with formulation chemistry for metal finishing since 2008. We provide a broad range of specialty products for electrodeposition processes and surface treatment, providing local inventory and service.

PROGRAM OVERVIEW:

Metal Finishing & Formulation Chemistry

  • Galvanic nickel brighteners and levelers
  • Components for galvanic tin, copper, zinc
  • Surfactants for electroplating
  • Surfactants for printed circuit boards
  • Pre-treatment cleaning additives
  • Post-treatment chemicals
Nickel Plating
PPS Secondary brightener and leveling agent
MPBSOH Leveling agent, high and medium current density ranges
BMP Brightener and leveling agent
DEP Leveling agent, brightener
PME Leveling agent, brightener
Copper Plating
DPS Brightener for acid copper
MPS Brightener for acid copper
SPS Brightener for acid copper
UPS Brightener for acid copper
ZPS Brightener for acid copper
IMK 8882 Leveler for acid copper
Dicolloy DNO-14 Nonionic surfactant, carrier
Zinc Plating
Benzylidene acetone Brightener
Dicolloy EHSO3 Anionic surfactant
Dicolloy NAPSO3 Anionic surfactant
IMK- 16-80 Nonionic surfactant

Specialty Surfactants

Anionic, low foaming and no cloud point. Dicolloy™ Alkoxy sulfonates have excellent salt stability, pH stability and very stable against hydrolysis over a wide pH range.

  • Dicolloy™ NAPSO3 / naphthol sulfoalkylated, propoxylated, alkali salt
  • Dicolloy™ EHSO3 / sulfopropylated, 2-ethylhexanol ethoxylate

Non-ionic, low foaming types.

  • Dicolloy™ NO-14 / ethoxylated, propoxylated beta-naphthol
  • IMK 16-80 / ethoxylated 2-ethylexanol
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